DLC Device comparison

  • DLC Device comparison
Film forming ARC Plasma CVD UBMS
Raw material Solid carbon C2H2 (gas) Solid carbon
Temperature ~400 ~200 ~250
Composition May hydrogen-free Hydrogen May hydrogen-free
Coefficient of friction 0.2~0.5 0.1~0.2 0.1~0.2
Hardness 2000~8000 1500~6000 1000~2000
Surface Rounghness Ra~10um Ra~0.02um Ra~0.1um
Adhesion Good Good Weak
Insulation Good Available Me-DLC Conductive

News